The xicron xi6 X-ray inspection system is specialized for the needs of small and medium-sized EMS manufacturers. Based on the patented hexapod motion unit, image acquisition in six degrees of freedom is virtually unlimited.

X-ray inspection is the method of choice for quality inspection of hidden solder joints, such as QFNs, BGAs, connectors, and THT solder joints. However, due to technological reasons, viewing through the populated circuit board also has the disadvantage of overlapping components.

The xi6 X-ray inspection systems have a powerful imageprocessing to reconstruct X-ray images from different viewing directions in layers and to mask out disturbing image signatures of superimposed layers.

With xi6 image acquisition, the beam source and detector are always perfectly aligned. This enables the highest image quality and avoids the otherwise typical planar offset-based image acquisition and the associated resolution reduction caused by off-axis blurring in the converter layer.